Engineering Technician D (Infrared Sensor)
Mason, Ohio
Job ID 36230L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.
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Job Title: Engineering Technician D (Infrared Sensor)
Job Code: 36230
Job Location: Mason, OH
Job Schedule: 1st Shift 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked – and have every other Friday off
Job Description:
We are seeking a highly skilled, detail-oriented Infrared Sensor Engineering Technician D to join our team in the development and production of Focal Plane Arrays (FPAs). The ideal candidate will have experience working with Application Specific Integrated Circuits (ASICs), specifically at the packaging level, and demonstrate a self-motivated approach while maintaining high work standards in technically challenging environments.
In this critical role, you will be responsible for integrating FPAs into test dewars in preparation for sensor testing and characterization, maintaining accurate part inventory records, and collaborating with engineers to perform failure analysis on FPAs. This position requires the ability to work effectively in a fast-paced, innovation-driven environment.
Essential Functions:
- Wire bonding FPAs
- Inspection and cleaning of FPAs
- Read and interpret mechanical drawings and electrical schematics
- Integrate dewars according to mechanical drawings and specifications
- Track FPAs throughout the build process and maintain detailed records
- Maintain dewar and FPA part inventories
- Provide FPA failure analysis support
- Communicate effectively with cross-functional teams
- Maneuver test equipment up to 25 lbs
Qualifications:
- Requires a High School Diploma or equivalent and a minimum of 8 years of prior relevant experience or 2 years post-Secondary/Associates Degree with a minimum of 4 years of prior related experience.
Preferred Additional Skills:
- Demonstrated experience with wire bonding
- Prior experience in ASIC packaging
- Prior experience with database data entry systems
- Advanced interpersonal and communication skills
- Proficiency using digital multimeters (DMM) for continuity checks, voltage measurements, and electrical troubleshooting
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